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128Mb: x4, x8, x16 SDRAM 3.3V
ICC OPERATING CONDITIONS AND MAXIMUM LIMITS: Vdd = 3.3V 10%V, Temp. = 25 to 70 C
Supply Current OPERATING CURRENT: ACTIVE mode, burst = 1, READ or WRITE, tRC > tRC (MIN), one bank active, CL=3 STANDBY CURRENT: POWER-DOWN mode, CKE = LOW, Standard parts no accesses in progress Self refresh parts STANDBY CURRENT: CS# = HIGH, CKE = HIGH, all banks idle STANDBY CURRENT: CS# = HIGH, CKE = HIGH, all banks active after tRCD met, no accesses in progress. OPERATING CURRENT: BURST mode after tRCD met, continuous burst, READ, WRITE, all banks active, CL=3 AUTO REFRESH CURRENT tRC > tRC (MIN) CL = 3 AUTO REFRESH CURRENT tRC=15.6us CL = 3 SELF REFRESH CURRENT (Self refresh parts only, part M) Symbol Icc1 Idd2 Idd2 Icc3 Icc4 Icc5 Icc6 Icc7 Idd8 -75A 165 9 3 75 75 165 265 50 3 -8A 140 9 3 60 50 145 245 50 3 Units mA mA mA mA mA mA mA mA mA Notes 1, 2, 3, 4 32 32 1, 2, 3, 4 1, 2, 3, 4 1, 2, 3, 4 1, 2, 3, 4 1, 2, 3, 4
Notes 1. All voltages referenced to Vss. 2. An initial pause of 100 s is required after power-up, followed by two AUTO REFRESH commands, before proper device operation is ensure. (Vdd and VddQ must be powered-up simultaneously Vss and VssQ must be at the same potential.) The two AUTO REFRESH command wake-ups should be repeated any time the tREF refresh requirement is exceeded. 3. Icc specifications are tested after the device is properly initialized. tCK= 10ns for -8 and tCK=7.5ns for -75A.
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
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SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek
128Mb: x4, x8, x16 SDRAM 3.3V
AC ELECTRICAL CHARACTERISTICS: Vdd = 3.3V 10%V, Temp. = 25 to 70C
AC CHARACTERISTICS PARAMETER Access time from CLK (positive edge) CL = 3 Access time from CLK (positive edge) CL = 2 Address hold time Address setup time CLK high level width CLK low level width Clock cycle time CL = 3 Clock cycle time CL = 2 CKE hold time CKE setup time CS#, RAS#, CAS#, WE#, DQM hold time CS#, RAS#, CAS#, WE#, DQM setup time Data-in hold time Data-in setup time Data-out high impedance time Data-out low impedance time Data-out hold time ACTIVE to PRECHARGE command period AUTO REFRESH to ACTIVE command period ACTIVE to READ or WRITE delay Refresh period (4096 cycles) PRECHARGE command period ACTIVE bank A to bank B command period Transition time Write recovery time Exit SELF REFRESH to ACTIVE command READ/WRITE command to READ/WRITE command CKE to clock disable or power down entry mode CKE to clock enable or power down exit setup SYMBOL tAC tAC tAH tAS tCH tCL tCK tCK tCKH tCKS tCMH tCMS tDH tDS tHZ tLZ tOH tRAS tRC tRCD tREF tRP tRRD tT tWR tXSR tCCD tCKED tPED -75A MIN -75A MAX 5.4 N/A -8A MIN -8A MAX 6 UNITS ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns ns ns ns tCK tCK tCK tCK NOTES
0.8 1.5 2.5 2.5 7.5 N/A 0.8 1.5 0.8 1.5 0.8 1.5 9 1 2.7 44 60 22.5 22.5 15 0.3 20 8 1 1 1
1 2 3 3 10 1 2 1 2 1 2 9 2 3 50 80 30 30 20 0.3 20 8 1 1 1
4
16K
16K
64
64
2
2
3 1 2 2
AC ELECTRICAL CHARACTERISTICS: Vdd = 3.3V 10%V, Temp. = 25 to 70C
AC CHARACTERISTICS PARAMETER DQM to input data delay WRITE command to input data delay Data-in to ACTIVATE command w/ Auto precharge Data-in to precharge Last data-in to precharge command LOAD MODE REGISTER command to command Data-out to high impedance from precharge SYMBOL tDQD tDWD tDAL tDPL tRDL tMRD tROH -75A MIN 0 0 5 2 2 2 3 -75A MAX -8 MIN 0 0 5 2 2 2 3 -8 MAX UNITS tCK tCK tCK tCK tCK tCK tCK NOTES 1 1 3 2, 3 1 1 1
NOTES: 1. Clocks required specified by JEDEC functionality and not dependent on any timing parameter. 2. Timing actually specified by tCKS, clock(s) specified as a reference only at a minimum cycle rate. 3. Timing actually specified by tWR plus tRP clock(s) specified as a reference only at a minimum cycle rate. 4. tHZ defines the time at which the output achieves the open circuit condition; it is not a reference to Voh or Vol. The last valid data element will meet tOH before going high-Z. 5. Based on tCK = 10ns for -8 and tCK = 7.5ns for -75a
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
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SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek
128Mb: x4, x8, x16 SDRAM 3.3V
54-PIN PLASTIC TSOP (400 mil)
(Package TK)
NOTE:
1. All dimensions in millimeters MAX/MIN or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
5
www.spectek.com
SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek
128Mb: x4, x8, x16 SDRAM 3.3V
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
6
www.spectek.com
SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek
128Mb: x4, x8, x16 SDRAM 3.3V
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
7
www.spectek.com
SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek
128Mb: x4, x8, x16 SDRAM 3.3V
FBGA "FB" PACKAGE 60-pin, 8mm x 16mm
NOTE:
1. All dimensions in millimeters. 2. Recommended Pad size for PCB is 0.33mm0.025mm.
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
8
www.spectek.com
SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek
128Mb: x4, x8, x16 SDRAM 3.3V
PART NUMBERS FOR PRODUCT PRIOR TO DECEMBER 2004 Options:
Architecture: 32 Meg x 4 (8 Meg x 4 x 4 banks) 16 Meg x 8 (4 Meg x 8 x 4 banks) 8 Meg x 16 (2 Meg x 16 x 4 banks) Voltage and Refresh: 3.3V, Auto Refresh 3.3V, Self or Auto Refresh1 Device Configuration: 32 Meg x 4 16 Meg x 8 8 Meg x 16 Package Types: 54-pin plastic TSOP (400 mil) 60-ball FBGA (8mm x 16mm) 60-ball FBGA (11mm x 13mm) Timing Types: PC100 (3-3-3) PC133 (3-3-3) Part number example: S80016LK7TW-8A
Marking:
S40032LK8 S80016LK7 S16008LK9 LK MK 8 7 9 TW FB2 FC2 -8A -75A
NOTES: 1. Only when specified. Consult Sales 2. Not available in x16 configuration http://www.spectek.com/menus/part_guides.asp
PDF: 09005aef807827f6 / Source: 09005aef807825bd 128Mb SDRAM Rev: 11/29/2004
9
www.spectek.com
SpecTek reserves the right to change products or specifications without notice. (c) 2001, 2002, 2004 SpecTek

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